在晶振使用或者是晶振焊接過(guò)程中，都會(huì)遇到許許多多的問(wèn)題,焊接問(wèn)題有時(shí)候會(huì)焊接不上,晶振產(chǎn)品掛不住在板子上,渥焊,假焊都是有可能的.晶振焊接上去帶不動(dòng)板子正常工作,又或者焊接過(guò)程中的失誤導(dǎo)致晶振在焊上板子之后偏差太大.
　　In the process of using crystal or crystal welding, there are many problems encountered. Welding problems sometimes cannot be soldered. Crystal products can't be hanged on the board. Soldering and false soldering are all possible. The normal operation of the plate, or the mistakes in the welding process, cause the crystal to deviate too much after welding the board.
　　在這里,泰河電子為大家整理了一份關(guān)于晶振產(chǎn)品的產(chǎn)品特性以及影響產(chǎn)品特性的因素,以供大家參考使用.喜歡的可以收藏起來(lái)后續(xù)再看.
Here, Taihe Electronics has compiled a product characteristic for the crystal product and factors affecting the product characteristics for your reference. You can collect it and follow it later.
　　首先是我們比較關(guān)心的常溫產(chǎn)品特性：常溫產(chǎn)品特性有時(shí)也稱為室溫產(chǎn)品特性，一般是指產(chǎn)品在環(huán)境溫度為25℃，相對(duì)濕度為50%左右時(shí)所測(cè)量出來(lái)的電性能參數(shù)，主要是頻率，電阻，激勵(lì)功率相關(guān)性及電容比等指標(biāo)。
　　First of all, we are concerned about the characteristics of normal temperature products: normal temperature product characteristics are sometimes called room temperature product characteristics, generally refers to the electrical performance parameters measured when the product temperature is 25 ° C, relative humidity is about 50%, mainly frequency , resistance, excitation power correlation and capacitance ratio indicators.

　　常溫下石英晶振產(chǎn)品的頻率主要是觀察其穩(wěn)定性與一致性。穩(wěn)定性是相對(duì)于單個(gè)產(chǎn)品而言，一方面要求產(chǎn)品在測(cè)試儀上重復(fù)測(cè)試時(shí)，頻率變化量要小，好產(chǎn)品頻率變化量可以小于±0.5ppm，與產(chǎn)品頻率高低及TS大小有關(guān)，一般情況下，頻率越高變化量越大，TS越大變化量越大，測(cè)量指標(biāo)一般是FL，若是FR則不存在TS的問(wèn)題；另一方面要求產(chǎn)品在電路中工作時(shí)不出現(xiàn)頻率漂移，也就是說(shuō)產(chǎn)品頻率不要跑到幾百甚至幾千ppm去，一般情況下只有高頻（27M以上）產(chǎn)品才會(huì)有這個(gè)問(wèn)題，尤其是3RD產(chǎn)品。
　　The frequency of the product at room temperature is mainly to observe its stability and consistency. The stability is relative to a single product. On the one hand, when the product is repeatedly tested on the tester, the frequency change is small, and the good product frequency variation can be less than ±0.5ppm, which is related to the product frequency and TS size. The higher the frequency, the larger the amount of change, the larger the TS is, the larger the change is. The measurement index is generally FL. If it is FR, there is no TS problem. On the other hand, the product does not have frequency drift when working in the circuit. Say that the product frequency should not go to hundreds or even thousands of ppm. Under normal circumstances, only high frequency (27M or more) products will have this problem, especially 3RD products.
如果頻率不穩(wěn)定，偏移的幅度上百ppm或同時(shí)伴有C0偏小現(xiàn)象，應(yīng)考慮膠點(diǎn)是否松動(dòng)。
　　If the frequency is unstable, the amplitude of the offset is hundreds of ppm or accompanied by a small C0 phenomenon, it should be considered whether the glue point is loose.
　　對(duì)于一條相對(duì)成熟的生產(chǎn)線來(lái)說(shuō)，產(chǎn)品在常溫下的頻率穩(wěn)定性一般不會(huì)出現(xiàn)問(wèn)題，比較常見的是產(chǎn)品的一致性（散差），尤其是高頻的小公差產(chǎn)品一致性往往不如人意。一致性考慮是多個(gè)產(chǎn)品的頻率公差，在測(cè)試系統(tǒng)中，觀察FL的正態(tài)分布圖可以很直觀的了解產(chǎn)品的一致，也可以使用儀器測(cè)試系統(tǒng)中的CPK計(jì)算功能，通過(guò)CPK來(lái)衡量產(chǎn)品的一致性。

　　For a relatively mature production line, the frequency stability of the product at normal temperature is generally not a problem, the more common is the consistency of the product (difference), especially the high-frequency small tolerance product consistency is often unsatisfactory. Consistency consideration is the frequency tolerance of multiple products. In the test system, observing the normal distribution map of FL can be very intuitive to understand the consistency of the product, and can also use the CPK calculation function in the instrument test system to measure the product by CPK. consistency.

　　因烤膠時(shí)間或溫度不正確也會(huì)造成頻率散差大，只是出現(xiàn)的概率較小，芯片原因造成頻率散差大一般在微調(diào)工序就能反映出來(lái)。為比較及時(shí)的了解頻率的一致性，應(yīng)在封焊工序增加一個(gè)抽檢工站，以考查微調(diào)封焊后狀況，尤其能較早發(fā)現(xiàn)微調(diào)范圍或微調(diào)人員的個(gè)體差異。分析原因時(shí)一定要考慮各批次產(chǎn)品在制程中流動(dòng)的時(shí)間是否大致相同，且越短越好，這一點(diǎn)對(duì)于產(chǎn)品的DLD特性也影響很大。
　　Due to the incorrect baking time or temperature, the frequency dispersion will be large, but the probability of occurrence is small. The large dispersion of the frequency caused by the chip is generally reflected in the fine adjustment process. In order to understand the consistency of frequency in a timely manner, a sampling station should be added in the sealing welding process to check the condition of fine-tuning after welding, especially to find the fine-tuning range or fine-tune the individual difference. When analyzing the cause, it must be considered whether the time of each batch of products flowing in the process is about the same, and the shorter the better, this also has a great impact on the DLD characteristics of the product.
　　常溫電阻特性主要是中心值與穩(wěn)定性。電阻中心值與控制上限的距離與產(chǎn)品的合格率息息相關(guān)，在測(cè)試系統(tǒng)中可以用平均值代替中心值，一般要求產(chǎn)品平均值是控制上限的50%左右。做制程改善時(shí)重點(diǎn)關(guān)注點(diǎn)膠與污染。
　　The room temperature resistance characteristics are mainly the center value and stability. The distance between the resistance center value and the control upper limit is closely related to the product qualification rate. In the test system, the average value can be used instead of the center value. Generally, the product average value is about 50% of the upper control limit. Focus on dispensing and contamination when making process improvements.
芯片不良在電阻大這一不良項(xiàng)中出現(xiàn)次數(shù)會(huì)比較多，特別是新的芯片供貨商或開發(fā)新頻點(diǎn)時(shí)。
Chip failures occur more frequently in the case of large resistors, especially when new chip suppliers or new frequency points are developed.
　　通常產(chǎn)品在常溫下的電阻要比頻率更穩(wěn)定，其變化量更容易控制在±0.5Ω以內(nèi)，一般只有高頻產(chǎn)品或3RD產(chǎn)品會(huì)出現(xiàn)此類問(wèn)題，如果產(chǎn)品有此類現(xiàn)象往往歸在可靠性中分析。
　　Generally, the resistance of the product at room temperature is more stable than the frequency, and the amount of change is more easily controlled within ±0.5 Ω. Generally, only high-frequency products or 3RD products may have such problems. If the product has such a phenomenon, it is often attributed to reliability. In the analysis.
　激勵(lì)功率相關(guān)性主要是考察產(chǎn)品在不同激勵(lì)功率下的頻率或電阻及其變化量，目前SMD產(chǎn)品設(shè)定的最小激勵(lì)功率一般是0.01uW，最大激勵(lì)功率一般是200 uW，20M以上的優(yōu)良產(chǎn)品DLD2和FDLD應(yīng)小于1，12M左右的低頻產(chǎn)品DLD2特性稍差，但其中心值也應(yīng)低于8Ω。產(chǎn)品DLD出問(wèn)題時(shí)的分析圖請(qǐng)參照產(chǎn)品電阻大的分析圖，但有一點(diǎn)應(yīng)特別引起重視—產(chǎn)品封焊前在制程中的流動(dòng)速度越快越好，各工序產(chǎn)出應(yīng)盡量平衡，減少物料在各工序等待時(shí)間。
　　The excitation power correlation is mainly to investigate the frequency or resistance of the product under different excitation power and its variation. At present, the minimum excitation power set by SMD products is generally 0.01uW, the maximum excitation power is generally 200 uW, and the excellent product DLD2 above 20M. The low-frequency product DLD2 with FDLD should be less than 1,12M is slightly inferior, but its center value should also be lower than 8Ω. For the analysis of the product DLD, please refer to the analysis chart of the product resistance, but one point should be paid special attention. The faster the flow rate in the process before the product is sealed, the better the output should be balanced and the materials should be reduced. Waiting time in each process.
DLD2：電阻激勵(lì)功率相關(guān)性（RRMAX — RRMIN）。單位：歐姆Ω
RLD2：激勵(lì)功率范圍內(nèi)的最大電阻。
FDLD：頻率激勵(lì)功率相關(guān)性（FLMAX ——FL MIN）
DELF（FLR）：串并聯(lián)間隔（FL—Fr）
DLDH2：不同激勵(lì)功率下的電阻遲滯（同一激勵(lì)功率點(diǎn)前后兩次測(cè)試的ESR最大差值）。
　　其次是貼片晶振產(chǎn)品的溫度特性：產(chǎn)品的溫度特性是指產(chǎn)品在不同溫度下的電性能變化情況，優(yōu)良產(chǎn)品的溫度特性呈光滑的三次曲線（AT切）或二次曲線（BT切），與理論曲線非常相似。主要影響因素是芯片的切型與切割角度，在石英芯片這一節(jié)中已有相關(guān)介紹，另外芯片加工過(guò)程的平面度（高頻）和修邊情況（低頻）也會(huì)影響產(chǎn)品的溫度特性。制程中芯片污染，電極偏位等也會(huì)對(duì)產(chǎn)品的溫度特性造成影響。
　　再然就是產(chǎn)品的可靠性（信賴性）：產(chǎn)品的可靠性可以通俗的理解為：產(chǎn)品生產(chǎn)完成后，不會(huì)因常規(guī)的搬運(yùn)，儲(chǔ)存而使其性能受影響，不會(huì)因客戶的焊接，清洗和封裝等各種使用條件而影響性能。產(chǎn)品的可靠性可以通過(guò)各種可靠性試驗(yàn)來(lái)衡量，目前常見的可靠性試驗(yàn)有：
高溫儲(chǔ)存試驗(yàn) 125℃±10℃；1000H±24H
溫度循環(huán)試驗(yàn) T1 = -55℃±10℃ T2= 125℃±10℃；循環(huán)次數(shù)10次。（溫度轉(zhuǎn)換約30分鐘）
溫度沖擊試驗(yàn) T1 = -55℃±10℃ T2= 125℃±10℃；循環(huán)次數(shù)10次。（溫度轉(zhuǎn)換時(shí)間5秒）
恒溫恒濕試驗(yàn) TC 85±10℃ H 85% ；1000H±24H
可焊性（焊錫）試驗(yàn) 230±10℃；3 s
耐焊接試驗(yàn) 260±10℃；10 s
跌落試驗(yàn) 75 cm；3 次。
振動(dòng)試驗(yàn) 頻率10 Hz — 2000 Hz；振幅 1.5 mm；每方向 40 分鐘。
老化率試驗(yàn) TC 85±10℃；300 H
壽命試驗(yàn)（MTBF）；85℃or125℃；1000H；利用公式及失效產(chǎn)品數(shù)計(jì)算出產(chǎn)品模擬壽命。
　　在以上十項(xiàng)試驗(yàn)中，恒溫恒濕試驗(yàn)主要考察產(chǎn)品儲(chǔ)存時(shí)會(huì)不會(huì)出現(xiàn)外觀變異，是否會(huì)影響焊接，可焊性（焊錫）試驗(yàn)主要考察產(chǎn)品在客戶端使用時(shí)能否順利焊接到電路板上，只要原材料不出問(wèn)題，產(chǎn)品在制程中不嚴(yán)重超溫，無(wú)嚴(yán)重污染就不會(huì)有問(wèn)題。
　　其余試驗(yàn)主要是通過(guò)對(duì)比試驗(yàn)前后產(chǎn)品的電性能變化情況來(lái)衡量產(chǎn)品的可靠性，其中高溫儲(chǔ)存試驗(yàn)，老化率試驗(yàn)和壽命試驗(yàn)考察產(chǎn)品的儲(chǔ)存條件與儲(chǔ)存時(shí)間；溫度循環(huán)試驗(yàn)和溫度沖擊試驗(yàn)考察產(chǎn)品在客戶端使用時(shí)對(duì)溫度變化的耐受情況。產(chǎn)品在制程中無(wú)明顯污染，銀層牢固，封焊時(shí)露點(diǎn)符合要求，檢漏無(wú)漏氣就能滿足要求。
　　跌落試驗(yàn)考察產(chǎn)品受機(jī)械力沖擊時(shí)的耐受情況，跌落試驗(yàn)不合格應(yīng)分兩各情況來(lái)處理，一是芯片破裂造成不良（高頻），應(yīng)檢查導(dǎo)電膠選用是否正確（較柔），底膠是否足夠，芯片在搭載時(shí)是否過(guò)低；另一各情況是脫膠，或稱膠點(diǎn)松動(dòng)，應(yīng)檢查烤膠工藝是否有問(wèn)題，芯片上下膠量是否足夠，上下膠連接處膠量是否飽滿。

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